Announcing the new DEMI 400™ Support & Resin Removal Solution

DEMI 400Announcing our latest innovation, the new automated and intelligent DEMI 400™ (originally named FORTI) support and resin removal solution. The DEMI 400 leverages PostProcess’ proven submersible technology already available in our DEMI 800 for consistent, hands-free support structure and resin removal on 3D printed PolyJet, FDM, SLA, and CLIP parts. We designed the DEMI 400 specifically to address the growing market demand for a software-driven system smaller than our production-scale DEMI 800™ machine.

Just like its big brother, the DEMI 800, the DEMI 400 is enabled by PostProcess’ patent-pending AUTOMAT3D™ software platform. Designed within our family of submersible support removal solutions, the DEMI 400’s highly engineered Submersed Vortex Cavitation (SVC) technology utilizes advanced ultrasonics, heat, and fluid flow in concert with our proprietary additive-formulated chemistry. An advanced pumping scheme creates vortex action to optimize the rate of removal of the support material and minimize buoyancy issues to virtually eliminate damaged parts. You can learn more about SVC technology in our recent video on the DEMI 800 solution.

With the DEMI 400’s software-driven automation, operators spend less time on tedious, manual support and resin removal and more time on value-added tasks. Utilizing user-friendly controls, throughput will accelerate with the ability to optimize cycles to produce consistent end parts via the system’s pre-designed agitation levels.

Whether you’re printing PolyJet, FDM, SLA, or CLIP parts, find out what the DEMI 400 can do for you and contact us today.

-> See the DEMI 400’s Specifications

-> Check out the full lineup in our Support & Resin Removal Family

-> Learn more about our technology on our Blog

How to Achieve the Fastest Processing Times Possible for SLA Resin Removal

SLA Resin RemovalOur most recent Press Release and White Paper address the topic of messy and cumbersome 3D printed SLA resin removal. We set out to achieve the fastest processing times possible with the development of an enhanced formulation of our chemistry, PLM-402-SUB (formerly named PG1.2), combined with our patented SVC technology to achieve unmatched end part consistency and hands-free automation.

This comparison chart is just a sampling of the data presented in the White Paper. The data demonstrates the unparalleled longevity of our PLM-402-SUB chemistry, which provides for resin removal on up to 1000 trays (average tray size = 15″) before reaching saturation. This increased longevity also reduces the costs of waste disposal and machine downtime as fewer detergent changeouts are required. The solution reduces the overall number of steps and chemical applications required from print to finish, driving increased productivity for technicians.

The White Paper explores in more detail how the PostProcess solution achieves the fastest resin removal on the market, cleaning trays of parts in 5-10 minutes, validated in multiple production environment test scenarios with 8 different resin materials.

To learn more, download the White Paper HERE.

Read the press release announcement on this innovation HERE.

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