Buffalo, NY, March 19, 2019 – PostProcess announced today a revolutionary new solution for SLA resin removal as a part of its offering of automated and intelligent additive manufacturing (AM) post-print technologies. Building on its existing portfolio of SLA resin removal technologies with an enhanced chemistry formulation, the groundbreaking PostProcess™ solution has been proven to deliver the fastest processing times on the market. Performing complete resin removal on 3D printed SLA parts consistently in 5 to 10 minutes, the system offers unmatched results in cleaning up to 5 times as many parts before detergent saturation versus traditional solvent resin removal.
The newly developed, patent-pending PostProcess SLA resin removal solution was validated in multiple production environments with 8 different resin materials. As a part of PostProcess’ comprehensive hardware, software, and chemistry approach, the solution utilizes patented SVC (Submersed Vortex Cavitation) technology in the DEMI™ and CENTI™ machines and proprietary AUTOMAT3D™ software to achieve unprecedented processing times and end part consistency. Software automation enables hands-free cleaning, precision control of parameters, advanced process monitoring, and proactive maintenance management.
The longevity of the PostProcess chemistry created for this solution, PG1.2, provides for resin removal on up to 1000 trays* in the DEMI machine before reaching saturation. This increased longevity also reduces the costs of waste disposal and machine downtime as fewer detergent changeouts are required. The PG1.2 chemistry also better addresses health and safety concerns compared with traditional solvent solutions, offering a lower vapor pressure and higher flash point. The new PostProcess solution reduces the overall number of steps and chemical applications required from print to finish, driving increased productivity for technicians.
“PostProcess’ latest innovation of the most advanced SLA resin removal solution in the world reinforces our commitment to providing the AM industry with transformative post-printing solutions enabling the market to scale”, commented Jeff Mize, CEO, PostProcess Technologies. “SLA is one of the most popular 3D printing technologies in the world. No matter what volume of printing, any SLA user can benefit from the remarkable efficiencies of our solution’s decreased processing time, increased throughput, increased detergent longevity, and improved safety. PostProcess has designed the world’s first complete SLA resin removal system, available only from the pioneers in forward-thinking 3D post-printing.”
This breakthrough SLA Resin Removal technology will be on display at the AMUG (Additive Manufacturing Users Group) Conference in Chicago, March 31 through April 4th, in PostProcess booth P21.
*Average tray size = 15″
-> Read the new White Paper
-> See SVC technology in this DEMI Video
-> Return to Press Releases Homepage