DEMI X 520 for Resin Removal

DEMIX520Rendering

 

When precision, efficiency, and safety matter most, the PostProcess DEMI X 520™ for Resin Removal sets a new standard in automated post-processing for resin-based additive manufacturing. Engineered to streamline post-print workflows, the DEMI X 520 combines advanced hardware, intelligent AUTOMAT3D software, and specially formulated chemistry into a fully integrated solution designed to deliver superior cleaning performance with minimal manual intervention.

Unlike traditional IPA-based cleaning methods, the DEMI X 520 utilizes safer detergent-based chemistry with a significantly higher flashpoint, helping manufacturers reduce flammability risks, improve workplace safety, and create a more environmentally sustainable operation.

The result is faster processing speeds, improved throughput, enhanced operator safety, and consistent, repeatable resin removal across complex geometries and production volumes. By automating and optimizing every stage of the cleaning process, the DEMI X 520 helps manufacturers achieve higher part quality, greater operational efficiency, and scalable production readiness.

Advantages of PostProcess DEMI X 520 for Resin Removal

  • Fast processing speeds
    With 2 minutes of operator time and a 10-minute cycle time, you can achieve significant labor and time savings!
  • Optimal sustainability
    Improve sustainability by generating 10x less waste than IPA, using the biocompatible PLM-403-SUB detergent.
  • Enhanced safety
    Resin removal chemistry offers a much lower flashpoint and greater longevity compared to IPA and other solvents.
  • Increased throughput
    DEMI X 520 can seamlessly process large batch sizes, enabling high-volume production and delivering unparalleled consistency.
  • Repeatable results
    Axial Flow Technology™ allows for adjustable flow, reducing the risk of part damage to guarantee intuitive, repeatable results even with complex parts.
  • Full software integration
    AUTOMAT3D® digital platform enables full customization and repeatability with one-touch operation.

DEMI X 520 Industrial Resin Workflow

White Paper: Eliminating IPA in Resin Cleaning

This white paper explores IPA-free resin cleaning methods, highlighting how eliminating IPA (isopropyl alcohol) can reduce safety risks, improve sustainability and create a safer, more efficient post-processing workflow.

Product Specifications

Electrical Requirements:

  • US | 120 Volt, 60Hz, 1-Phase
  • EU | 230 Volt, 50 Hz, 1-Phase

Envelope Capacity:

  • 14″ L x 14″ W x 15″ H (36 x 36 x 38 cm)

Lift Capacity:

  • 10 lbs (4.5 kg)

Consumables Used:

  • PLM-403-SUB

Consumables Capacity:

  • 24 gallons (91 liters)

Machine Dimensions (WxDxH):

  • Doors Closed: 32” L x 25” W x 67” H (82 x 64 x 170 cm)
  • Doors Open: 54.6” L x 28.9” W x 67.8” H (139 x 73 x 172 cm)

System Weight:

  • Empty: Approx. 325 lbs (147 kg)
  • Full: Approx. 525 lbs (238 kg)

System Warranty:

  • 12 months on-site service and support, as per PostProcess Technologies conditions of sale.

Environmental Requirements:

  • Temperature range: 60-80°F (15-27°C)
  • Relative humidity: 0-80%

Software: 

  • AUTOMAT3D, Windows 10

Regulatory Conformity:

  • CE, SGS

Features & Options:

  • Customizable settings with recipe storage capability / Ability to clean parts and trays simultaneously on or off platform / Up to 10X longevity over IPA / Flashpoint over 200°F / 93°C

Safety Features:

  • Emergency stop / Safety enclosure with door sensor

Connectivity:

  • USB Port: USB 3.1
  • Ethernet: Fully compliant with IEE 802.3, IEEE 802.3u, IEEE 802.3ab

Material Compatibility: 

  • All vat photopolymerization resins including rigid, elastomeric, high-temperature and composite filled resins.

Printer Compatibility:

  • Designed for use with any DLP or SLA printer.

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