U.S. Patent No. 10,737,440
“Apparatus and Method for Support Removal”
Our Submersed Vortex Cavitation (SVC) technology was officially granted a U.S. patent on August 11, 2020. Utilized in our popular DEMI 200, DEMI 400 Series, DEMI 800 Series, and DEMI 4000 Series support and resin removal solutions, SVC serves as a revolutionary software-driven alternative to traditional submersion tanks or blasting. In this technology, 3D printed parts are uniformly, consistently, and reliably exposed to our optimized, patent-pending detergent as they undergo post-printing by ultrasonic generated cavitations, manned by our vortex pumping scheme.
In testing, the SVC technology has been shown to enable an average breakage rate of a mere 0.1%, compared to an average 3% during the water-blasting process. SVC is revolutionary for improving additive workflow efficiencies, as well as maintaining the integrity of parts. Counterparts of this patent are currently pending worldwide.