The PostProcess™ DEMI 200™ Support & Resin Removal solution provides all the conveniences of a compact bench-top footprint, with an envelope sized for a few large or several small geometries. Rely on the patent-pending DEMI 200 for superior PolyJet and FDM support removal and excess SLA, DLP, and CLIP resin removal
The DEMI 200 includes our patented Submersed Vortex Cavitation (SVC) technology, a rotating motion while immersed in fluid for disposing support material and providing even exposure to induced mechanical agitation. Utilizing our proprietary software and paired with our exclusive detergents, the right amount of time, and exact temperature based on the material and geometry of the 3D printed part, the DEMI 200 delivers precise, hands-free post-printing for additively manufactured parts.
Want to learn more about to DEMI 200? Download the PDF Specifications and watch the latest “How It Works” video!
*Available in North America only