DEMI X 5000 | Automated Resin Cleaning Solution

The PostProcess DEMI X 5000™ automated resin removal for large-format SLA production, purpose-built to complement the SLA 825 Dual from 3D Systems. Engineered to increase efficiency, safety, and consistency.

By integrating advanced software, robust hardware, and proprietary chemistry, the DEMI X 5000 optimizes post-print cleaning while reducing manual labor and variability in high-volume additive applications.

Its proprietary non-flammable chemistry provides up to 75% lower waste–disposal costs compared to traditional IPA-based methods. Its fully enclosed process envelope and automated lift system improve efficiency and operator safety while supporting environmentally responsible operations.

Together, the DEMI X 5000 and the SLA 825 Dual create a validated workflow for scalable, production-ready SLA manufacturing.

Advantages of PostProcess DEMI X 5000

Increased productivity
Designed to process large SLA build parts in 10 minutes or less for significant labor time savings.
Increased throughput
Dual agitation flow delivers both vertical and horizontal vortex for superior resin removal especially with complex parts with hidden and concave surfaces.
Enhanced safety
Resin removal chemistry offers an exceedingly safer flashpoint and increased longevity compared to IPA and other solvents.
Improved Process Sealing
Fully enclosed chamber minimizes vapor escape for a safer and cleaner work environment.
Full software integration
AUTOMAT3D® digital platform allows for one-touch operation with full customization, recipe storage, and repeatability for complex parts.
Optimal sustainability
Improves sustainability efforts with 10x reduced waste generation compared to IPA.

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IPA Free Resin Cleaning White Paper - PostProcess

White Paper: Eliminating IPA in Resin Cleaning

This white paper explores IPA-free resin cleaning methods, highlighting how eliminating IPA (isopropyl alcohol) can reduce safety risks, improve sustainability and create a safer, more efficient post-processing workflow.

Download White Paper >>

Product Specifications

Electrical Requirements:

US | 240 Volt, 30 Amp, 3-Phase
EU | 230 Volt, 30 Amp, 3-Phase

Envelope Capacity:

35″ L x 35″ W x 25″ H (89 x 89 x 63.5 cm)

Lift Capacity:

200 lbs (90kg)

Consumables Used:

PLM-403-SUB
- Implement an IPA-free resin removal workflow with AUX-400-RINSE as the final rinse step.
  - **Note: rinse step is to be performed in separate container, not to be used in PostProcess hardware

Consumables Capacity:

275 gallons (1,041 liters)

Machine Dimensions:

Doors Closed: 94″ L x 42.6″ W x 84.5″ H (239 x 108 x 215 cm)
Doors Open w/Light: 132″ L x 92″ W x 99.5″ H (336 x 233 x 253 cm)

System Weight:

Empty: Approx. 2,073 lbs (940 kg)
Full: Approx. 4,370 lbs (1,982 kg)

System Warranty:

12 months on-site service and support, as per PostProcess Technologies conditions of sale.

Environmental Requirements:

Temperature Range: 5-40° C (41-104° F)

Software:

AUTOMAT3D, Windows 10

Regulatory Conformity:

CE, SGS

Features & Options:

Dual agitation flow for superior resin removal / Adjustable tilt mechanism / Customizable settings with recipe storage / Detergent up to 10X longevity over IPA

Safety Features:

Emergency stop / Auto power down / Safety interlocked door

Connectivity:

USB Port: USB 3.1
Ethernet: Fully compliant with IEE 802.3, IEEE 802.3u, IEEE 802.3ab

Material Compatibility:

All Vat Photopolymerization resins including rigid, elastomeric, high-temperature and composite filled resins.

Printer Compatibility:

Designed for all large format printers including those from Stratasys, 3D Systems, UnionTech, and others.

Download PDF Specifications