The World’s Only IPA Free Resin Removal Workflow

PostProcess^® continues to advance additive manufacturing support removal with the new DEMI X 520 for Resin Removal™. As the industry’s only full-stack solution, it extends the PostProcess Submersed Vortex Cavitation™ portfolio by introducing our new Axial Flow Technology™ combined with our game-changing chemistry and customized AUTOMAT3D^® software.

Customized Software Controls

Resin removal software and features guide users through processing requirements, including time, temperature, and agitation for their particular application. These tailored experiences create a seamless, efficient, and error-free operation.

Hardware Innovation and Fixtures Ensure Optimal Resin Removal & Safety

The DEMI X 520 for Resin Removal offers new hardware features to deliver unparalleled consistency.

• Automated parts lift protects parts from over-exposure to chemistry and contributes to operator safety.
• Specific resin removal fixtures ensure optimal part processing regardless of processing parts directly on the build platform or batch processing off-platform.
• Axial Flow Technology ensures uniform chemistry exposure to finish parts.

Additive-Formulated Chemistry for Isopropyl Alcohol (IPA) Free Processing

The DEMI X 520 for Resin Removal Solution features a combination of PLM-403-SUB detergent used in the hardware, followed by a rinse step in a sample of AUX-400-RINSE with provided sample container.

• Enhances safety for employees thanks to higher flashpoints vs IPA (53°F / 11°C):
  • PLM-403-SUB Flashpoint: 220°F / 104.4°C
  • AUX-400-RINSE Flashpoint: 102°F / 38.8°C
• Biocompatible PLM-403-SUB detergent ensures effective resin removal, with most cycles completed in >10 minutes.
• AUX-400-RINSE as a final rinse step eliminates the need to use IPA in your resin removal workflow.

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