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Find Your Perfect Automated Post-Print Solution

Ready to transform your post-printing operations?

Let’s find the ideal technology for your unique needs.

Answer the questions below to explore the range of proven PostProcess solutions suited to your additive manufacturing operations.




Your Matches

DEMI X 520 for Resin Removal

Submersible system ideal for Resin removal, PolyJet support removal, and wax support removal.

Achieve revolutionary post-processing efficiencies and automation with the PostProcess® DEMI X 520™, the newest addition to our Submersed Vortex Cavitation (SVC) portfolio. The comprehensive solution features intuitive software, robust hardware and additive specific chemistry to provide optimal resin and support removal. Learn more…

Envelope: 14″ L x 14″ W x 15” H
Axial flow agitation system
Automatic lift system
Precise control of all variables based on application

DEMI 4000 Series – Resin Removal

Submersible system ideal for SLA, CLIP, and DLP technologies.

The DEMI 4000 can seamlessly process large part sizes or large builds with many smaller-sized parts, improving cycle times and increasing throughput. The utilization of a powered lift system eliminates the need for multiple machines, allowing ergonomic, operator-friendly same-height loading of multiple build trays. Learn more…

  • Envelope: 35″ L x 35″ W x 25” H
  • Automatic lift to raise and lower build trays into detergent
  • Piezo-electric Ultrasonics
  • Precise control of all variables

DECI Duo Surface Finish

Dual process spray system ideal for FDM, SLA, SLS, DMLS/Binder Jetting and MJF technologies.

Finishes even the most complex parts, including those with internal channels, organic geometries, and honeycombs. Uses proprietary AUTOMAT3D™ software and consumables. Thoughtfully designed with a space-saving footprint, noise-reducing features, smart electrical panel, and pass-through door capability. Learn more…

  • Envelope: 15” D x 15” H
  • Total Footprint with Door Closed: 69.5″ L x 37″ W x 94″ H
  • Pre-programmed preventative maintenance schedules
  • One-touch repeatability with recipes storage
  • Precise control of all variables

BASE Support Removal

Our largest envelope spray system ideal for FDM, SLA, PolyJet, and CLIP technologies.

Delivers uniform, high-quality results for every part, regardless of geometry. Short cycle times to meet high-volume production needs. Delicate to robust support removal with higher throughput using highly engineered spray agitation to ensure complete part coverage. AUTOMAT3D software delivers intelligence with pre-programmed preventative maintenance schedules and one-touch repeatability with recipes storage. Learn more…

  • Envelope: 40” L x 27 1/2” W x 26” H
  • Total Footprint with Door Closed: 68.7″ L x 40.7″ W x 93.2″ H
  • Set and save programs for future runs
  • Customizable settings
  • Precise control of all variables

DEMI 800 Series – Support & Resin Removal

Submersible system ideal for SLA, PolyJet, and CLIP technologies.

Highly engineered for the demands of volume production while ensuring consistency of every part. AUTOMAT3D® software optimizes precise energy delivery and variable motion for fast, uniform support and resin removal. Motion of fluids controlled by our Agitation Algorithms adjusts sensor data in real-time so parts are not damaged and removal of supports and excess resin is consistent. Learn more…

  • Envelope: 18″ L x 18″ W x 18” H
  • Monitors and reacts to key process factors
  • Piezo-electric Ultrasonics
  • Precise control of all variables

DEMI 400 Series – Support & Resin Removal

Submersible system ideal for FDM, SLA, PolyJet, and CLIP technologies.

Highly engineered for the demands of volume production while ensuring consistency of every part. AUTOMAT3D® software optimizes precise energy delivery and variable motion for fast, uniform support and excess removal. Motion of fluids controlled by our Agitation Algorithms adjusts sensor data in real-time so parts are not damaged and removal is consistent. Learn more…

  • Envelope: 14″ L x 14″ W x 14″ H
  • Programmable cycle times
  • Precise, hands-free support removal
  • Uses Piezo-electric Ultrasonics

RADOR Surface Finish

Surface finish system ideal for FDM, SLA, SLS, PolyJet, MJF and CLIP technologies.

Applies patent-pending technology, including optimized energy with vertical motion combined with our proprietary eco-friendly consumables to achieve the required surface finish. Learn more…

  • Envelope: 21.4” L x 8.4” W x 13” H
  • Footprint with door closed: 54.3” L x 28.3” W x 39.4” H
  • Software-driven intelligence
  • Intelligent cycle times
  • Variable detergent dosing

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